Home Inovação New heat dissipation device design achieves a 47% weight reduction in a...

New heat dissipation device design achieves a 47% weight reduction in a non-terrestrial network planar antenna

0

New heat dissipation device design achieves a 47% weight reduction in a non-terrestrial network planar antenna

The National Institute of Information and Communications Technology, Sharp Corp, Mitsubishi Chemical Corp, and TECHLAB Co, jointly reduced the total weight of a planar antenna for NTN (Non-Terrestrial Network) applications by 47% (from 5.5 kilograms to 2.9 kilograms) through a new heat dissipation device design.


Quero saber mais sobre como ter sucesso no mundo digital

Sair da versão mobile